BS EN IEC 62148-21:2019
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Fibre optic active components and devices. Package and interface standards Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
Hardcopy , PDF
English
08-05-2019
15-06-2021
This part of IEC 62148 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA).
| Committee |
GEL/86/3
|
| DocumentType |
Standard
|
| ISBN |
9780580988325
|
| Pages |
18
|
| ProductNote |
THIS STANDARD ALSO REFERS TO IEC TR 61931,IEC 62148-19
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy |
This part of IEC 62148 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative.
The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages.
| Standards | Relationship |
| IEC 62148-21:2019 | Identical |
| EN IEC 62148-21:2019 | Identical |
| EN 50122-1:2011/A1:2011 | Identical |
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