BS EN IEC 62878-2-603:2025
Current
Current
The latest, up-to-date edition.
Device embedding assembly technology Guideline for stacked electronic module. Test method of intra-module electrical connectivity
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
16-04-2025
Publisher
€188.48
Excluding VAT
| Committee |
EPL/501
|
| DocumentType |
Standard
|
| Pages |
18
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
IEC 62878-2-603:2025 specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules. This method is realized to make use of bidirectional serial communication bus interface applied to the stackable electronic modules which are assured as \'known good module\' (KGM).
| Standards | Relationship |
| I.S. EN IEC 62878-2-603:2025 | Equivalent |
| IEC 62878-2-603:2025 | Equivalent |
| EN IEC 62878-2-603:2025 | Equivalent |
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