Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

31-10-2013

Publisher

British Standards Institution

1 Scope
2 Terms and definitions
3 Test method for measuring tin whisker growth
4 Acceptance procedure for tin and tin alloy
  surface finishes
5 Acceptance criteria
6 Reporting of results
7 On-going tin whisker evaluation
Annex A (normative) - Test method for measuring
        whisker growth on tin and tin alloy surface
        finishes of semiconductor devices

Specifies the methodology applicable for environmental acceptance testing of tin-based surface finishes and mitigation practices for tin whiskers on semiconductor devices.

IEC 62483:2013 describes the methodology applicable for environmental acceptance testing of tin-based surface finishes and mitigation practices for tin whiskers on semiconductor devices. This methodology may not be sufficient for applications with special requirements, (i.e. military, aerospace, etc.). Additional requirements may be specified in the appropriate requirements (procurement) documentation. This first edition is based on JEDEC documents JESD201A and JESD22-A121A and replaces IEC/PAS 62483, published in 2006. This first edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
a) The content of IEC/PAS 62483 was added to the content of JESD201A as Annex A.
b) A methodology was introduced for environmental acceptance testing of tin-based surface finishes and mitigation practices for tin whiskers.
c) A Clause 6 was introduced detailing the reporting requirements of test results.

Committee	EPL/47
DevelopmentNote	Supersedes DD IEC/PAS 62483 & 12/30262263 DC. (10/2013)
DocumentType	Standard
Pages	52
PublisherName	British Standards Institution
Status	Current
Supersedes	DD IEC/PAS 62483:2006 12/30262263 DC : 0

Standards	Relationship
IEC 62483:2013	Identical

IPC JP002 : 0

JEDEC/IPC CURRENT TIN WHISKERS THEORY AND MITIGATION PRACTICES GUIDELINE

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BS IEC 62483:2013

Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices

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