BS PD ES 59008-4.1 : 2001
Current
The latest, up-to-date edition.
DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 4-1: SPECIFIC REQUIREMENTS AND RECOMMENDATIONS - TEST AND QUALITY
Hardcopy , PDF
English
01-01-2001
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Foreword
Introduction
1 Scope
2 Normative references
3 Definitions
4 Requirements
5 Availability of information and conformity
5.1 Publication of data
5.2 Data tabulation and exchange
5.3 Conformity level
6 Essential information
6.1 Yield
Annex F (normative) Use of codes
This Standard defines requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures, and minimally packaged semiconductor die. This Standard also gives recommendations for general industry good practice in the use of bare die, with or without connection structures, and minimally packaged die. This defines the requirements for the data needed to describe the test and quality parameters of the die.
| Committee |
EPL/547
|
| DevelopmentNote |
Inactive for the new design. (02/2009)
|
| DocumentType |
Standard
|
| Pages |
14
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Standards | Relationship |
| ES 59008-4-1 : 2000 | Identical |
| ES 59008-6-2 : 2001 | DATA REQUIREMENTS FOR SEMI CONDUCTOR DIE - DATA DICTIONARY |
| ES 59008-6-1 : 1999 | DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 6-1 - EXCHANGE DATA FORMATS AND DATA DICTIONARY - DATA EXCHANGE - DDX FILE FORMAT |
| ES 59008-3 : 1999 | DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 3 - MECHANICAL, MATERIAL AND CONNECTIVITY REQUIREMENTS |
| ES 59008-1 : 1999 | DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 1 - GENERAL REQUIREMENTS |
| ES 59008-2 : 1999 | DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 2 - VOCABULARY |
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