DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 4-1: SPECIFIC REQUIREMENTS AND RECOMMENDATIONS - TEST AND QUALITY

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2001

Publisher

British Standards Institution

Foreword
Introduction
1 Scope
2 Normative references
3 Definitions
4 Requirements
5 Availability of information and conformity
5.1 Publication of data
5.2 Data tabulation and exchange
5.3 Conformity level
6 Essential information
6.1 Yield
Annex F (normative) Use of codes

This Standard defines requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures, and minimally packaged semiconductor die. This Standard also gives recommendations for general industry good practice in the use of bare die, with or without connection structures, and minimally packaged die. This defines the requirements for the data needed to describe the test and quality parameters of the die.

Committee	EPL/547
DevelopmentNote	Inactive for the new design. (02/2009)
DocumentType	Standard
Pages	14
PublisherName	British Standards Institution
Status	Current

Standards	Relationship
ES 59008-4-1 : 2000	Identical

ES 59008-6-2 : 2001	DATA REQUIREMENTS FOR SEMI CONDUCTOR DIE - DATA DICTIONARY
ES 59008-6-1 : 1999	DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 6-1 - EXCHANGE DATA FORMATS AND DATA DICTIONARY - DATA EXCHANGE - DDX FILE FORMAT
ES 59008-3 : 1999	DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 3 - MECHANICAL, MATERIAL AND CONNECTIVITY REQUIREMENTS
ES 59008-1 : 1999	DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 1 - GENERAL REQUIREMENTS
ES 59008-2 : 1999	DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 2 - VOCABULARY

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BS PD ES 59008-4.1 : 2001

DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 4-1: SPECIFIC REQUIREMENTS AND RECOMMENDATIONS - TEST AND QUALITY

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Abstract

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Standards Referencing This Book

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