BS PD ES 59008-5.1 : 2001
Current
The latest, up-to-date edition.
DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 5-1: PARTICULAR REQUIREMENTS AND RECOMMENDATIONS FOR DIE TYPES - BARE DIE
Hardcopy , PDF
English
01-01-2001
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1 Scope
2 Normative references
3 Definitions
4 Conformity levels
5 Specific recommendations - Test and Quality
5.1 General
5.2 Wafer map or binning information
5.3 Photo and thermal sensitive devices
5.4 Traceability
5.5 Wafer probing information
6 Specific recommendations - User or assembler related
issues, techniques, best practice and material selection
6.1 General
6.2 Die attach material
6.3 Bonding method
6.4 Bond pad surface
6.5 Bond wire information
6.6 Power bonds
6.7 Die substrate connection
6.8 Peak temperature and duration
6.9 Unusual material
6.10 Die coat material, thickness and process
6.11 Die attach limitations
6.12 Backside surface roughness
7 Specific recommendations - Handing, including wafer
saw and pick & place issues, and storage
7.1 General
7.2 Saw kerf shape and saw line width
7.3 Redundancy or programmable fuse areas
7.4 Fiducials
7.5 Die identity marking
7.6 Wafer identity
7.7 Unusual handling limitations
7.8 Specific handling precautions when opening
primary packing containing die
7.9 Ionic contamination protection
7.10 Use of de-ionised water
7.11 Sensitive surface areas
7.12 Orientation
7.13 Storage
8 Specific recommendations - Thermal, including
modelling
8.1 General
8.2 Die attach material
9 Specific recommendations - Electrical, including
simulation
9.1 General
9.2 Interconnect methods and dimensions
9.3 Die substrate connection and method
10 Specific recommendations - Application environment
10.1 General
10.2 Photo-sensitivity
10.3 Optical, photo emitters
10.4 Radiation tolerance
10.5 Upscreening concerns
10.6 Extended temperatures
10.7 MEMS requirements (chemical, magnetic, mechanical,
biological etc) and the need to protect other die
11 Summary of information requirements
Specifies requirements for the exchange of data pertaining to bare semiconductor die with or without connection structures, and minimally-packaged semiconductor die.
| Committee |
EPL/547
|
| DevelopmentNote |
Also numbered as ES 59008-5-1. (06/2001) Inactive for the new design. (02/2009)
|
| DocumentType |
Standard
|
| Pages |
14
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Standards | Relationship |
| ES 59008-5-1 : 2001 | Identical |
| ES 59008-4-1 : 2000 | DATA REQUIREMENTS FOR SEMI-CONDUCTOR DIE - SPECIFIC REQUIREMENTS AND RECOMMENDATIONS - TEST AND QUALITY |
| FED-STD-209 Revision E:1992 | AIRBORNE PARTICULATE CLEANLINESS CLASSES IN CLEANROOMS AND CLEAN ZONES |
| ES 59008-3 : 1999 | DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 3 - MECHANICAL, MATERIAL AND CONNECTIVITY REQUIREMENTS |
| ES 59008-1 : 1999 | DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 1 - GENERAL REQUIREMENTS |
| ES 59008-2 : 1999 | DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 2 - VOCABULARY |
| ES 59008-4-3 : 1999 | DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 4-3 - SPECIFIC REQUIREMENTS AND RECOMMENDATIONS - THERMAL |
| ES 59008-4-4 : 1999 | DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 4-4: SPECIFIC REQUIREMENTS AND RECOMMENDATIONS - ELECTRICAL SIMULATION |
| ES 59008-4-2 : 2000 | DATA REQUIREMENTS FOR SEMICONDUCTOR DIE : SPECIFIC REQUIREMENTS AND RECOMMENDATIONS HANDLING AND STORAGE |
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