BS PD ES 59008-6.2 : 2001
Current
The latest, up-to-date edition.
DATA REQUIREMENTS FOR SEMI-CONDUCTOR DIE - DATA DICTIONARY
Hardcopy , PDF
English
01-01-2001
Specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures, and minimally packaged semiconductor die. It also gives recommendations for general industry good practice in the use of bare die, with or without connection structures, and minimally packaged die.
Committee |
EPL/547
|
DevelopmentNote |
Also numbered as ES 59008-6-2. (05/2001) Inactive for the new design. (02/2009)
|
DocumentType |
Standard
|
Pages |
26
|
PublisherName |
British Standards Institution
|
Status |
Current
|
Standards | Relationship |
ES 59008-6-2 : 2001 | Identical |
ES 59008-6-1 : 1999 | DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 6-1 - EXCHANGE DATA FORMATS AND DATA DICTIONARY - DATA EXCHANGE - DDX FILE FORMAT |
EN 61360-4:2005/corrigendum:2005 | STANDARD DATA ELEMENT TYPES WITH ASSOCIATED CLASSIFICATION SCHEME FOR ELECTRIC COMPONENTS - PART 4: IEC REFERENCE COLLECTION OF STANDARD DATA ELEMENT TYPES AND COMPONENT CLASSES |
ES 59008-3 : 1999 | DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 3 - MECHANICAL, MATERIAL AND CONNECTIVITY REQUIREMENTS |
ES 59008-1 : 1999 | DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 1 - GENERAL REQUIREMENTS |
ES 59008-2 : 1999 | DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 2 - VOCABULARY |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.