BS CECC 23300-003:1991
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Specification for harmonized system of quality assessment for electronic components. Capability detail specification: multilayer printed boards
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BS CECC23400-800(1991) : 1991 AMD 7368
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HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: CAPABILITY DETAIL SPECIFICATION: FLEXIBLE PRINTED BOARDS WITHOUT THROUGH-CONNECTIONS
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I.S. EN 123100:1994
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SECTIONAL SPECIFICATION: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLAIN HOLES
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EN 123300 : 1992 AMD 1 1995
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SECTIONAL SPECIFICATION: MULTILAYER PRINTED BOARDS
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BS CECC 23300-800(1990) : AMD 7366
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: CAPABILITY DETAIL SPECIFICATION; MULTILAYER PRINTED BOARDS
|
BS CECC23100-800(1990) : AMD 7360
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: CAPABILITY DETAIL SPECIFICATION: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLAIN HOLES
|
BS CECC23300(1989) : 1989 AMD 7364
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SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: MULTILAYER PRINTED BOARDS
|
I.S. EN 123300:1994
|
SECTIONAL SPECIFICATION: MULTILAYER PRINTED BOARDS
|
I.S. EN 123500:1994
|
SECTIONAL SPECIFICATION: FLEXIBLE PRINTED BOARDS WITH THROUGH CONNECTIONS
|
BS CECC23100(1989) : 1989 AMD 7358
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLAIN HOLES
|
BS CECC23500(1990) : 1990 AMD 7369
|
SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: FLEXIBLE PRINTED BOARDS WITH THROUGH CONNECTIONS
|
BS CECC23400(1990) : 1990 AMD 7367
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: FLEXIBLE PRINTED BOARDS WITHOUT THROUGH CONNECTIONS
|
BS CECC23500-800(1991) : 1991 AMD 7370
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: CAPABILITY DETAIL SPECIFICATION: FLEXIBLE PRINTED BOARDS WITH THROUGH-CONNECTIONS
|
BS CECC23200-800(1990) : AMD 7363
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: CAPABILITY DETAIL SPECIFICATION: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLATED-THROUGH HOLES
|
BS CECC 23100-003:1991
|
Specification for harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plain holes
|
BS CECC23200(1989) : 1989 AMD 7361
|
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLATED THROUGH HOLES
|
BS CECC 23200-003:1991
|
Specification for harmonized system of quality assessment for electronic components: capability detail specification: single and double sided printed boards with plated-through holes
|
I.S. EN 123200:1994
|
SECTIONAL SPECIFICATION: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLATED-THROUGH HOLES
|
EN 123500:1992/A2:1995
|
SECTIONAL SPECIFICATION: FLEXIBLE PRINTED BOARDS WITH THROUGH CONNECTIONS
|
EN 123100 : 1992 AMD 1 1995
|
SECTIONAL SPECIFICATION: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLAIN HOLES
|
EN 123200:1992/A1:1995
|
SECTIONAL SPECIFICATION: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLATED-THROUGH HOLES
|