CECC 23300-801 : 1998
Current
The latest, up-to-date edition.
CAPABILITY DETAIL SPECIFICATION - MULTI-LAYER PRINTED BOARDS
12-01-2013
1 GENERAL
1.1 Scope
1.2 Object
2 CAPABILITY QUALIFYING COMPONENT
2.1 Materials
2.2 Surface finishes
2.2.1 Metallic finishes
2.2.1.1 Accelerated ageing
2.2.2 Organic finishes
2.3 Variant designation
3 CAPABILITY APPROVAL
3.1 Range of capability approval
3.2 QPL information
4 CAPABILITY TEST PROGRAMME
4.1 Capability demonstration
4.1.1 Other metallic surface finishes
4.1.2 Organic surface finishes
4.1.3 External bonded heatsinks
4.1.4 Demonstration of impedance control
5 ADDITIONAL CAPABILITY
6 TRACEABILITY
Tables
I Capability approval test schedule
IIa Additional metallic conductor finishes
IIb Additional contact finishes
III Permanent organic finishes
IV Bonded heatsinks
Annex A Suitable test pattern for marking inks
Annex B Suitable test pattern for solder masks
Annex C Suitable test pattern for bonded heatsinks
Annex D Edge connector imperfections
Annex E CTP subdivision for thermal shock
Annex F Circumferential defects in plated-through holes
Annex G Determination of characteristic impedance by TDR
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