CECC 23300-801 : 1998

1 GENERAL
    1.1 Scope
    1.2 Object
2 CAPABILITY QUALIFYING COMPONENT
    2.1 Materials
    2.2 Surface finishes
          2.2.1 Metallic finishes
                  2.2.1.1 Accelerated ageing
          2.2.2 Organic finishes
    2.3 Variant designation
3 CAPABILITY APPROVAL
    3.1 Range of capability approval
    3.2 QPL information
4 CAPABILITY TEST PROGRAMME
    4.1 Capability demonstration
          4.1.1 Other metallic surface finishes
          4.1.2 Organic surface finishes
          4.1.3 External bonded heatsinks
          4.1.4 Demonstration of impedance control
5 ADDITIONAL CAPABILITY
6 TRACEABILITY
Tables
I Capability approval test schedule
IIa Additional metallic conductor finishes
IIb Additional contact finishes
III Permanent organic finishes
IV Bonded heatsinks
Annex A Suitable test pattern for marking inks
Annex B Suitable test pattern for solder masks
Annex C Suitable test pattern for bonded heatsinks
Annex D Edge connector imperfections
Annex E CTP subdivision for thermal shock
Annex F Circumferential defects in plated-through holes
Annex G Determination of characteristic impedance by TDR

Concerned with rigid multilayer printed boards, made with materials and surface finishes as defined in clause 2. Defines the Capability Qualifying component (CQC), its characteristics for testing, the test procedure and conditions for application, together with requirements for fulfilling for testing of basic and extended capability.