CECC 23600-801 : 1998
Current
The latest, up-to-date edition.
CAPABILITY DETAIL SPECIFICATION - FLEX-RIGID MULTILAYER PRINTED BOARDS WITH THROUGH CONNECTIONS
12-01-2013
1 GENERAL
1.1 Scope
1.2 Object
2 CAPABILITY QUALIFYING COMPONENT
2.1 Materials
2.2 Surfaces finishes
2.2.1 Metallic finishes
2.2.1.1 Accelerated ageing
2.2.2 Organic finishes
2.3 Variant designation
3 CAPABILITY APPROVAL
3.1 Range of capability approval
3.2 QPL information
4 CAPABILITY TEST PROGRAMME
4.1 Capability demonstration
4.1.1 Other metallic surface finishes
4.1.2 Organic surface finishes
5 ADDITIONAL CAPABILITY
6 TRACEABILITY
Table I Capability approval test schedule
Table IIa Additional metallic conductor finishes
Table IIb Additional contact finishes
Table III Permanent organic finishes
Annex A Edge connector imperfections
Annex B Circumferential defects in plated-through holes
Concerned with flex-rigid multilayer printed boards having through connections, made from materials and surface finishes as defined in clause 2. Defines the Capability component (CQC), its characteristics for testing, test procedures and conditions for application and requirements for fulfilment for testing basic and extended capability.
Committee |
SR 52
|
DocumentType |
Standard
|
PublisherName |
Cenelec Electronic Components Committee
|
Status |
Current
|
Standards | Relationship |
BS CECC 23600-801:1998 | Identical |
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