CEI EN 60191-6-2 : 2002
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-2: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR 1,50 MM, 1,27 MM AND 1,00 MM PITCH BALL AND COLUMN TERMINAL PACKAGES
Hardcopy , PDF
English
01-01-2002
Important note : Users cannot be edited or removed once added to your Multi user PDF.
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Definitions
4 Ball terminal packages, 1,50 mm, 1,27 mm and
1,00 mm pitch Reference characters and drawings
5 Column terminal packages, 1,50 mm, 1,27 mm
and 1,00 mm pitch Reference characters and drawings
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Defines the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-1002. (07/2015)
|
| DocumentType |
Standard
|
| Pages |
22
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| EN 60191-6-2:2002 | Identical |
| IEC 60191-6-2:2001 | Identical |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.