CEI EN 60191-6-6 : 2002
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR FINE PITCH LAND GRID ARRAY (FLGA)
Hardcopy , PDF
English
01-01-2002
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Definitions
Annex ZA (normative) - Normative references to
international publications with their corresponding
European publications
Gives common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-1006. (07/2015)
|
| DocumentType |
Standard
|
| Pages |
20
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| IEC 60191-6-6:2001 | Identical |
| EN 60191-6-6:2001 | Identical |
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