MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-8: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR GLASS SEALED CERAMIC QUAD FLATPACK (G-QFP)

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2002

Publisher

Comitato Elettrotecnico Italiano

FOREWORD
1 Scope and object
2 Normative references
3 Definitions
4 Numbering of the pins
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications

Gives the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP).

Committee	CT 309
DevelopmentNote	Classificazione CEI 47-1007. (07/2015)
DocumentType	Standard
Pages	18
PublisherName	Comitato Elettrotecnico Italiano
Status	Current

Standards	Relationship
IEC 60191-6-8:2001	Identical
EN 60191-6-8:2001	Identical

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CEI EN 60191-6-8 : 2002

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-8: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR GLASS SEALED CERAMIC QUAD FLATPACK (G-QFP)

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