MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-8: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR GLASS SEALED CERAMIC QUAD FLATPACK (G-QFP)

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Hardcopy , PDF

Language(s)

English

Published date

01-02-2002

Publisher

Comitato Elettrotecnico Italiano

€35.72

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FOREWORD
1 Scope and object
2 Normative references
3 Definitions
4 Numbering of the pins
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications

Standard implemented through announcement in CEINFORMA February 2002.

Committee	CT 309
DevelopmentNote	Classificazione CEI 47-1007. (07/2015)
DocumentType	Standard
Pages	18
PublisherName	Comitato Elettrotecnico Italiano
Status	Current

Standards	Relationship
IEC 60191-6-8:2001	Identical
EN 60191-6-8:2001	Identical

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CEI EN 60191-6-8 : 2002

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-8: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR GLASS SEALED CERAMIC QUAD FLATPACK (G-QFP)

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CEI EN 60191-6-8 : 2002

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-8: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR GLASS SEALED CERAMIC QUAD FLATPACK (G-QFP)

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