CEI EN 60191-6-8 : 2002
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-8: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR GLASS SEALED CERAMIC QUAD FLATPACK (G-QFP)
Hardcopy , PDF
English
01-02-2002
FOREWORD
1 Scope and object
2 Normative references
3 Definitions
4 Numbering of the pins
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Standard implemented through announcement in CEINFORMA February 2002.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-1007. (07/2015)
|
| DocumentType |
Standard
|
| Pages |
18
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| IEC 60191-6-8:2001 | Identical |
| EN 60191-6-8:2001 | Identical |
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