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CEI EN 60749-22 : 2004

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 22: BOND STRENGTH

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2004

€38.37
Excluding VAT

Foreword
Introduction
1 Scope and object
2 Methods A and B
3 Method C
4 Method D
5 Methods E and F
6 Method G: Wire ball
  shear test
7 Information to be given
  in the relevant specification
Annex A (normative) - Guidance

Defines to semiconductor devices (discrete devices and integrated circuits).

Committee
CT 309
DevelopmentNote
Classificazione CEI 47-26 (04/2004) Supersedes CEI EN 60749. (05/2008)
DocumentType
Standard
Pages
28
PublisherName
Comitato Elettrotecnico Italiano
Status
Current
Supersedes

Standards Relationship
IEC 60749-22:2002 Identical
EN 60749-22:2003 Identical

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