CEI EN 61189-5-3 : 2016
Current
The latest, up-to-date edition.
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES
Hardcopy , PDF
English
01-01-2016
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Accuracy, precision and resolution
4 X: Miscellaneous test methods
Annex A (informative) - Typical comparison of particle size
distributions between laser diffraction method and
screen method
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Gives a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 91-82. To be read in conjunction with CEI EN 61189-1, CEI EN 61189-2 and CEI EN 61189-3. (06/2016)
|
| DocumentType |
Standard
|
| Pages |
48
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| EN 61189-5-3:2015 | Identical |
| IEC 61189-5-3:2015 | Identical |
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