CEI EN 61190-1-3:2003-01
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Fixing materials for electronic assembliesPart 1-3: Requirements for electronic-grade solders and fluxed and non-fluxed solid solders in the assembly of electronic components
Published date
01-01-2003
Publisher
Superseded date
12-08-2025
Superseded by
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This part of IEC 61190 defines the requirements and test methods for fluxed and unfluxed rod, strip and powder solder alloys other than solder paste for electronics soldering applications and for special electronics grade solder alloys.
| Committee |
CT 309
|
| DocumentType |
Standard
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| IEC 61190-1-3:2002 | Identical |
| EN 61190-1-3:2002 | Identical |
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