CEI EN 62047-12 : 2012
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MICROELECTROMECHANICAL DEVICES - PART 12: BENDING FATIGUE TESTING METHOD OF THIN FILM MATERIALS USING RESONANT VIBRATION OF MEMS STRUCTURES
Hardcopy , PDF
English
01-01-2012
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test equipment
5 Specimen
6 Test conditions
7 Initial measurement
8 Test
9 Test report
Annex A (informative) - Example of testing using an
electrostatic device with an integrated actuation
component and displacement detection component
Annex B (informative) - Example of testing using an
external drive and a device with an integrated
strain gauge for detecting displacement
Annex C (informative) - Example of electromagnetic
drive out-of-plane vibration test (external drive
vibration test)
Annex D (informative) - Theoretical expression on
fatigue life of brittle materials based on Paris
law and Weibull distribution
Annex E (informative) - Analysis examples
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Describes the method for bending fatigue testing using resonant vibration of microscale mechanical structures of MEMS (micro-electromechanical systems) and micromachines.
Committee |
CT 309
|
DevelopmentNote |
Classificazione CEI 47-103. (12/2012)
|
DocumentType |
Standard
|
Pages |
36
|
PublisherName |
Comitato Elettrotecnico Italiano
|
Status |
Current
|
Standards | Relationship |
EN 62047-12 : 2011 | Identical |
IEC 62047-12:2011 | Identical |
IEC 62047-2:2006 | Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials |
IEC 62047-3:2006 | Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing |
EN 62047-3 : 2006 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 3: THIN FILM STANDARD TEST PIECE FOR TENSILE TESTING |
ISO 12107:2012 | Metallic materials — Fatigue testing — Statistical planning and analysis of data |
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