CEI EN 62047-12 : 2012
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MICROELECTROMECHANICAL DEVICES - PART 12: BENDING FATIGUE TESTING METHOD OF THIN FILM MATERIALS USING RESONANT VIBRATION OF MEMS STRUCTURES
Hardcopy , PDF
English
01-01-2012
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test equipment
5 Specimen
6 Test conditions
7 Initial measurement
8 Test
9 Test report
Annex A (informative) - Example of testing using an
electrostatic device with an integrated actuation
component and displacement detection component
Annex B (informative) - Example of testing using an
external drive and a device with an integrated
strain gauge for detecting displacement
Annex C (informative) - Example of electromagnetic
drive out-of-plane vibration test (external drive
vibration test)
Annex D (informative) - Theoretical expression on
fatigue life of brittle materials based on Paris
law and Weibull distribution
Annex E (informative) - Analysis examples
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Important note : Users cannot be edited or removed once added to your Multi user PDF.Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.