CEI EN 62047-15 : 2019
Current
Current
The latest, up-to-date edition.
Semiconductor devices - Micro-electromechanical devices Part 15: Test method of bonding strength between PDMS and glass
Available format(s)
Hardcopy , PDF
Language(s)
Italian
Published date
01-04-2019
Publisher
| Committee |
CT 309
|
| DocumentType |
Standard
|
| Pages |
0
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Supersedes |
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