CEI EN 62047-17 : 2016
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 17: BULGE TEST METHOD FOR MEASURING MECHANICAL PROPERTIES OF THIN FILMS
Hardcopy , PDF
English
01-01-2016
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FOREWORD
1 Scope
2 Normative references
3 Terms, definitions and symbols
4 Principle of bulge test
5 Test apparatus and environment
6 Specimen
7 Test procedure and analysis
8 Test report
Annex A (informative) - Determination of mechanical properties
Annex B (informative) - Deformation measurement techniques
Annex C (informative) - Example of test piece fabrication:
MEMS process
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Defines the method for performing bulge tests on the free-standing film that is bulged within a window.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-127. (08/2017)
|
| DocumentType |
Standard
|
| Pages |
34
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| IEC 62047-17:2015 | Identical |
| EN 62047-17:2015 | Identical |
| IEC 62047-2:2006 | Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials |
| EN 62047-2:2006 | Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials |
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