CEI EN 62047-17 : 2016
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 17: BULGE TEST METHOD FOR MEASURING MECHANICAL PROPERTIES OF THIN FILMS
Hardcopy , PDF
English
01-01-2016
FOREWORD
1 Scope
2 Normative references
3 Terms, definitions and symbols
4 Principle of bulge test
5 Test apparatus and environment
6 Specimen
7 Test procedure and analysis
8 Test report
Annex A (informative) - Determination of mechanical properties
Annex B (informative) - Deformation measurement techniques
Annex C (informative) - Example of test piece fabrication:
MEMS process
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Important note : Users cannot be edited or removed once added to your Multi user PDF.Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.