SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 2: TENSILE TESTING METHOD OF THIN FILM MATERIALS

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2007

Publisher

Comitato Elettrotecnico Italiano

FOREWORD
1 Scope
2 Normative references
3 Symbols and designations
4 Testing method and test apparatus
5 Test piece
6 Test report
Annex A (informative) - Test piece grip methods
Annex B (normative) - Testing conditions
Annex C (informative) - Test piece
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications

Describes the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 [mu]m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices.

Committee	CT 309
DevelopmentNote	Classificazione CEI 47-1028. (09/2015)
DocumentType	Standard
Pages	20
PublisherName	Comitato Elettrotecnico Italiano
Status	Current

Standards	Relationship
IEC 62047-2:2006	Identical
EN 62047-2:2006	Identical

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CEI EN 62047-2 : 2007

SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 2: TENSILE TESTING METHOD OF THIN FILM MATERIALS

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Abstract

General Product Information

International Equivalents

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