CEI EN 62047-3 : 2007
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 3: THIN FILM STANDARD TEST PIECE FOR TENSILE TESTING
Hardcopy , PDF
English
01-01-2007
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FOREWORD
1 Scope
2 Normative references
3 Test piece materials
4 Test piece fabrications
5 Plane shape of test piece
6 Test piece thickness
7 Gauge mark
8 Test
9 Document attached to standard test pieces
Annex A (informative) - Test piece
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Describes the standard test piece, which is used to guarantee the propriety and accuracy of a tensile testing system for thin film materials with length and width under 1 mm and thickness under 10 [mu]m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-1029. (09/2015)
|
| DocumentType |
Standard
|
| Pages |
16
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| EN 62047-3 : 2006 | Identical |
| IEC 62047-3:2006 | Identical |
| IEC 62047-2:2006 | Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials |
| EN 62047-2:2006 | Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials |
| ISO 17561:2016 | Fine ceramics (advanced ceramics, advanced technical ceramics) — Test method for elastic moduli of monolithic ceramics at room temperature by sonic resonance |
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