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CEI EN 62047-8 : 2012

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 8: STRIP BENDING TEST METHOD FOR TENSILE PROPERTY MEASUREMENT OF THIN FILMS

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2012

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Test piece
6 Test procedure and analysis
7 Test report
Annex A (informative) - Data analysis: Test results
        by using nanoindentation apparatus
Annex B (informative) - Test piece fabrication:
        MEMS process
Annex C (informative) - Effect of misalignment and
        geometry on property measurement
Bibliography

Describes the strip bending test method to measure tensile properties of thin films with high accuracy, repeatability, moderate effort of alignment and handling compared to the conventional tensile test.

Committee
CT 309
DevelopmentNote
Classificazione CEI 47-89. (06/2012)
DocumentType
Standard
Pages
24
PublisherName
Comitato Elettrotecnico Italiano
Status
Current

Standards Relationship
IEC 62047-8:2011 Identical
EN 62047-8:2011 Identical

IEC 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
IEC 62047-3:2006 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing

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