CEI EN 62258-6 : 2007
Current
The latest, up-to-date edition.
SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION
Hardcopy , PDF
English
01-01-2007
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General
5 Requirements for information for thermal simulation
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Describes the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-1031. (09/2015)
|
| DocumentType |
Standard
|
| Pages |
16
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| IEC 62258-6:2006 | Identical |
| EN 62258-6 : 2006 | Identical |
| EN 62258-2:2011 | SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS |
| IEC 62258-1:2009 | Semiconductor die products - Part 1: Procurement and use |
| EN 62258-1:2010 | Semiconductor die products - Part 1: Procurement and use |
| IEC 62258-2:2011 | Semiconductor die products - Part 2: Exchange data formats |
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