CEI EN 62418 : 2011
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - METALLIZATION STRESS VOID TEST
Hardcopy , PDF
English
01-01-2011
FOREWORD
1 Scope
2 Test equipment
3 Test structure
4 Stress temperature
5 Procedure
6 Failure criteria
7 Data interpretation and lifetime extrapolation
(resistance change method)
8 Items to be specified and reported
Annex A (informative) - Stress migration
mechanism
Annex B (informative) - Technology-dependent
factors for aluminium
Annex C (informative) - Technology-dependent
factors for copper
Annex D (informative) - Precautions
Bibliography
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