CEI EN 62739-2 : 1ED 2017
Current
The latest, up-to-date edition.
TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 2: EROSION TEST METHOD FOR METAL MATERIALS WITH SURFACE PROCESSING
25-07-2017
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test
5 Erosion depth measurement
6 Items to be recorded in test report
Annex A (normative) - Specifications of test equipment and
measurement equipment
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Specifies an evaluating test method for the erosion of the metallic materials with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 91-91. (07/2017)
|
| DocumentType |
Standard
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| IEC 62739-2:2016 | Identical |
| EN 62739-2:2016 | Identical |
| EN 61190-1-3:2007/A1:2010 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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