CEI EN IEC 60749-15:2021
Current
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2020)
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-05-2021
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.This part of IEC 60749 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering.
| Committee |
CT 309
|
| DocumentType |
Test Method
|
| ISBN |
978-2-8322-8604-3
|
| Pages |
18
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| EN IEC 60749-15:2020 | Identical |
| IEC 60749-15:2020 | Identical |
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