Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2020)

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01-05-2021

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Comitato Elettrotecnico Italiano

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This part of IEC 60749 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering.

Committee	CT 309
DocumentType	Test Method
ISBN	978-2-8322-8604-3
Pages	18
PublisherName	Comitato Elettrotecnico Italiano
Status	Current
Supersedes	CEI EN 60749-15 : 2012

Standards	Relationship
EN IEC 60749-15:2020	Identical
IEC 60749-15:2020	Identical

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CEI EN IEC 60749-15:2021

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2020)

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CEI EN IEC 60749-15:2021

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2020)

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