CEI EN IEC 61188-6-3:2025-03
Current
Current
The latest, up-to-date edition.
Circuit boards and circuit board assemblies - Design and use – Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-03-2025
Publisher
€86.00
Excluding VAT
This part of IEC 61188 specifies the requirements for lands and land pattern on circuit boards for the mounting of components with leads by soldering based on the solder joint requirements of IEC 61191-1 and IEC 61191-3.
| Committee |
CT 309
|
| DocumentType |
Standard
|
| ISBN |
978-2-8327-0069-3
|
| Pages |
40
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 61188-6-3:2024 | Identical |
| EN IEC 61188-6-3:2025 | Identical |
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