Name: CEI EN IEC 61189-5-301:2022 - Test Methods for Electrical Materials, Printed Circuit Boards and Other Interconnect Structures and Assemblies Part 5-301: General Test Methods for Materials and Assemblies - Solder Paste with Fine Particles of Solder Material
Brand: Comitato Elettrotecnico Italiano

Test Methods for Electrical Materials, Printed Circuit Boards and Other Interconnect Structures and Assemblies Part 5-301: General Test Methods for Materials and Assemblies - Solder Paste with Fine Particles of Solder Material

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2022

Publisher

Comitato Elettrotecnico Italiano

€92.61

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This Standard is published by the CEI in English only as it is particularly aimed at specialized sectors.

Committee	CT 309
DocumentType	Test Method
ISBN	978-2-8322-9534-2
Pages	42
PublisherName	Comitato Elettrotecnico Italiano
Status	Current

Standards	Relationship
EN IEC 61189-5-301:2021	Identical
IEC 61189-5-301:2021	Identical

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CEI EN IEC 61189-5-301:2022

Test Methods for Electrical Materials, Printed Circuit Boards and Other Interconnect Structures and Assemblies Part 5-301: General Test Methods for Materials and Assemblies - Solder Paste with Fine Particles of Solder Material

Abstract

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