CEI EN IEC 62239-1 : 2019
Current
The latest, up-to-date edition.
Process management for avionics - Management plan Part 1: Preparation and maintenance of an electronic components management plan
Hardcopy , PDF
English
15-03-2019
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This part of IEC 62239 defines the requirements for developing an electronic components management plan (ECMP) to guarantee to customers that all of the electronic components in the equipment of the plan owner are selected and applied in controlled processes compatible with the end application and that the technical requirements detailed in Clause 4 are accomplished.
| Committee |
CT 309
|
| DocumentType |
Standard
|
| ISBN |
978-2-8322-6033-3
|
| Pages |
0
|
| ProductNote |
THIS STANDARD ALSO REFERS TO IPC/JEDEC J-STD-20,IECQ OD 3702,IECQ OD 3407-1,IECQ 03-4,ANSI/ESDA/JEDEC JS-001,AS/EN/JISQ 9000,AS/EN/JISQ 9100,AS/EN/JISQ 9110,AS/EN/JISQ 9120,DEF.STAN.00-71,SAE EIA-STD-4899,DLA SMD-5962-87517,GIFAS/5052/2008,IATF 16949,IPC/JEDEC J-STD-020,
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| EN IEC 62239-1:2018 | Identical |
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