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CEI EN IEC 62769-103-4:2023

Current

Current

The latest, up-to-date edition.

Field device integration (FDI) - Part 103-4: Profiles - PROFINET

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-10-2023

This part of IEC 62769 specifies an FDI profile of IEC 62769 for IEC 61784-2_CP 3/4, IEC 61784-2_CP3/5 and IEC 61784-2_CP3/6 (PROFINET1).

Committee
CT 65
DocumentType
Standard
ISBN
978-2-8322-6821-6
Pages
46
PublisherName
Comitato Elettrotecnico Italiano
Status
Current
Supersedes

Standards Relationship
EN IEC 62769-103-4:2023 Identical
IEC 62769-103-4:2023 Identical

IEC 61804-5:2020 Devices and intergration in enterprise systems - Function blocks (FB) for process control and electronic device description language (EDDL) - Part 5: EDDL Builtin library
IEC 62769-151-1:2023 Field device integration (FDI®) - Part 151-1: Profiles - OPC UA
IEEE 802.3-2018 IEEE Standard for Ethernet
IEC 61804-4:2020 Devices and integration in enterprise systems - Function blocks (FB) for process control and electronic device description language (EDDL) - Part 4: EDD interpretation
ISO/IEC 11578:1996 Information technology — Open Systems Interconnection — Remote Procedure Call (RPC)

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