• CEI EN IEC 62769-4:2023

    Current The latest, up-to-date edition.

    Field Device Integration (FDI®) Part 4: FDI Packages

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-09-2023

    Publisher:  Comitato Elettrotecnico Italiano

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    Abstract - (Show below) - (Hide below)

    This part of IEC 62769 specifies the FDI®1 Packages.

    General Product Information - (Show below) - (Hide below)

    Committee CT 65
    Document Type Standard
    Publisher Comitato Elettrotecnico Italiano
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 62591:2016 Industrial networks - Wireless communication network and communication profiles - WirelessHARTTM
    IEC 61784-1-3:2023 Industrial networks - Profiles - Part 1-3: Fieldbus profiles - Communication Profile Family 3
    IEC 61784-1-9:2023 Industrial networks - Profiles - Part 1-9: Fieldbus profiles - Communication Profile Family 9
    IEC 61784-1-1:2023 Industrial networks - Profiles - Part 1-1: Fieldbus profiles - Communication Profile Family 1
    IEC 62734:2014 Industrial networks - Wireless communication network and communication profiles - ISA 100.11a
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