CEI EN IEC 62769-8:2023
Current
Current
The latest, up-to-date edition.
Field device integration (FDI®) Part 8: EDD to OPC-UA Mapping
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-09-2023
Publisher
This part of IEC 62769 specifies how the internal view of a device model represented by the EDD can be transferred into an external view as an OPC-UA information model by mapping EDD constructs to OPC-UA objects.
Committee |
CT 65
|
DocumentType |
Standard
|
ISBN |
978-2-8322-6792-9
|
Pages |
62
|
PublisherName |
Comitato Elettrotecnico Italiano
|
Status |
Current
|
Standards | Relationship |
IEC 62769-8:2023 | Identical |
EN IEC 62769-8:2023 | Identical |
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