CEI EN IEC 62878-2-603:2025-05
Current
Current
The latest, up-to-date edition.
Device embedding assembly technology – Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-05-2025
Publisher
€46.31
Excluding VAT
This part of IEC 62878 specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules.
| Committee |
CT 309
|
| DocumentType |
Test Method
|
| ISBN |
978-2-8327-0240-6
|
| Pages |
22
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| EN IEC 62878-2-603:2025 | Identical |
| IEC 62878-2-603:2025 | Identical |
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