CEI EN IEC 63287-2:2023
Current
Current
The latest, up-to-date edition.
Semiconductor devices - Guidelines for reliability qualification plans Part 2: Concept of mission profile
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-09-2023
Publisher
€52.92
Excluding VAT
This part of IEC 63287 gives guidelines for the development of reliability qualification plans using the concept of mission profile, based on the environmental conditioning and proposed usage of the product.
| Committee |
CT 309
|
| DocumentType |
Standard
|
| ISBN |
978-2-8322-6708-0
|
| Pages |
24
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| EN IEC 63287-2:2023 | Identical |
| IEC 63287-2:2023 | Identical |
| JEDEC JESD47J.01:2017 | Stress-Test-Driven Qualification of Integrated Circuits |
| IECQ 03-5:2017 | IEC Quality Assessment System for Electronic Components (IECQ System) - Rules of Procedure - Part 5: IECQ HSPM Scheme - Hazardous Substance Process Management Requirements |
| IECQ 01A:2011 | IEC Quality Assessment System for Electronic Components (IECQ System) - IECQ Guide - Guidance for the use of the IECQ Logo and IECQ Mark of Conformity |
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