CEI EN IEC 63287-2:2023
Current
Current
The latest, up-to-date edition.
Semiconductor devices - Guidelines for reliability qualification plans Part 2: Concept of mission profile
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-09-2023
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.This part of IEC 63287 gives guidelines for the development of reliability qualification plans using the concept of mission profile, based on the environmental conditioning and proposed usage of the product.
| Committee |
CT 309
|
| DocumentType |
Standard
|
| ISBN |
978-2-8322-6708-0
|
| Pages |
24
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| EN IEC 63287-2:2023 | Identical |
| IEC 63287-2:2023 | Identical |
| IECQ 03-5:2017 | IEC Quality Assessment System for Electronic Components (IECQ System) - Rules of Procedure - Part 5: IECQ HSPM Scheme - Hazardous Substance Process Management Requirements |
| IECQ 01A:2011 | IEC Quality Assessment System for Electronic Components (IECQ System) - IECQ Guide - Guidance for the use of the IECQ Logo and IECQ Mark of Conformity |
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