DD IEC/PAS 62326-14:2010

FOREWORD
1 Scope
2 Normative references
3 General definitions
4 Test methods
5 Test items and test equipment
6 Indication, packaging and storage
7 Design guide
Annex A (informative) - Specimen for surface
        resistance measurement of electronic circuit
        board
Annex B (informative) - Insulation resistance
        measurement of inner layer of electronic
        circuit board
Annex C (informative) - Specimen for interlayer
        insulation resistance measurement for
        multilayer circuit board
Annex D (informative) - Electronic wiring board
        product system
Annex E (informative) - Steps of electronic circuit
        board assembly and main applications
Bibliography

Applies to device embedded substrates fabricated by embedding discrete active and passive electronic devices into an inner layer of a substrate with electric connections by vias, conductor plating, conductive paste, and printing. The device embedded substrate may be used as a substrate to mount SMDs to form electronic circuits, as conductor and insulator layers may be formed after embedding electronic devices.

IEC/PAS 62326-14:2010(E) is applicable to device embedded substrates fabricated by embedding discrete active and passive electronic devices into an inner layer of a substrate with electric connections by vias, conductor plating, conductive paste, and printing. The device embedded substrate may be used as a substrate to mount SMDs to form electronic circuits, as conductor and insulator layers may be formed after embedding electronic devices. The purpose of this PAS is to obtain common understanding in design, fabrication and use of device embedded substrates in the industry. This PAS describes the substrate embedding devices including but not limited to module, integrated passive device (IPD), microelectrochemical systems (MEMS), discrete component formed in the fabrication process of the electronic wiring board, and sheet form component. This PAS does not specify the fabrication process of device embedded substrates, via diameter/via land diameter, conductor width/conductor spacing nor conductor line density.