DEFSTAN 00-77(PT1)/1(2005) : INTERIM

0 Introduction
  0.1 Purpose
  0.2 Document structure
1 Scope
2 WARNING
3 Normative References
4 Terms, definitions and abbreviations
  4.1 Terms and definitions
  4.2 Abbreviations
  4.3 Precedence
  4.4 Definition of terms
       4.4.1 General terms
       4.4.2 Module mechanical items
       4.4.3 Tolerances
5 Generic module specification
  5.1 Introduction
  5.2 Module description
  5.3 Module Physical Specification
       5.3.1 Module envelope: height, length, width
       5.3.2 Module Distortion
       5.3.3 Module mass
       5.3.4 Module insertion and extraction
       5.3.5 Electrical safety
       5.3.6 Materials
       5.3.7 Module Identification
  5.4 Module Physical Interface - Connector
       5.4.1 Connector shell dimensions
       5.4.2 Module connector shell location
       5.4.3 Connector Cavities, Inserts, Ferrules and Contacts
       5.4.4 Mating sequence
       5.4.5 Guide pins and sockets
       5.4.6 Keying
       5.4.7 Environmental Protection and Cleaning
  5.5 Module Physical Interface - Cooling
       5.5.1 Conduction Cooled Module Interface
       5.5.2 Air Cooled Module Interface
  5.6 Module Physical Interface - Insertion Extraction Device
6 Module Mechanical Tests
  6.1 Master gauge test
  6.2 Module insertion and extraction
       6.2.1 Module insertion
       6.2.2 Module extraction
       6.2.3 Durability
       6.2.4 Keying pin integrity
       6.2.5 Module header torque
       6.2.6 Module cantilever load
7 Guidelines for a rack slot
  7.1 Introduction
  7.2 Interchangeability
  7.3 Rack Slot Design Requirements
       7.3.1 Slot description
       7.3.2 Slot physical dimensions
       7.3.3 Materials
       7.3.4 Anodic treatment and plating
       7.3.5 Slot Mark
  7.4 Connector interface
  7.5 Conduction Cooled Interface
       7.5.1 Guide Rail outline drawing
       7.5.2 Specific requirements for conduction cooled rack slot
  7.6 Air Flow Cooled Interface
       7.6.1 Guide Rail Outline drawing
       7.6.2 Specific requirements for Air Flow Through cooled slot
  7.7 Relationship between Cooling, Connector and IED Rack
       Interfaces
8 Typical modular avionics environment
  8.1 Ambient pressure (altitude)
  8.2 Humidity
  8.3 High and low temperatures
       8.3.1 Temperature environmental conditions
       8.3.2 Storage temperatures
  8.4 Thermal shocks
  8.5 Salt spray
  8.6 Vibrations
       8.6.1 Sinusoidal vibrations
       8.6.2 Random vibrations
       8.6.3 Gunfire vibrations
       8.6.4 Combined vibrations (Helicopter)
  8.7 Accelerations
       8.7.1 Rotational accelerations
       8.7.2 Transversal accelerations
  8.8 Mechanical shocks
       8.8.1 Functional shocks
       8.8.2 Bench handling
       8.8.3 Crash handling
       8.8.4 Catapult launch, arrested landing
  8.9 Contamination resistance
  8.10 Flame resistance
  8.11 Fungus resistance
  8.12 Rain
  8.13 Acoustic noise
  8.14 Electromagnetic environment
  8.15 Explosive atmosphere
  8.16 Nuclear, Biological and Chemical (NBC) Hazards
       8.16.1 Nuclear threats
       8.16.2 Biological and Chemical
  8.17 Sand and dust
  8.18 Single Event Upset/Multiple Bit Upset
  8.19 Module Tempest

Provides uniform requirements for Packaging for the Common Functional Modules (CFM) within an Integrated Modular Avionic (IMA) system, as defined per ASAAC.