DIN EN 60191-6-2:2002-09
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-2: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES; DESIGN GUIDE FOR 1,50 MM, 1,27 MM AND 1,00 MM PITCH BALL AND COLUMN TERMINAL PACKAGES
Hardcopy , PDF
German
01-01-2002
Important note : Users cannot be edited or removed once added to your Multi user PDF.
1 Scope
2 Normative references
3 Definitions
4 Ball terminal packages, 1,50 mm, 1,27 mm and 1,00 mm
pitch
5 Column terminal packages, 1,50 mm, 1,27 mm and
1,00 mm pitch
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Gives the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).
| DevelopmentNote |
Supersedes DIN IEC 47D-301-CD. (09/2002)
|
| DocumentType |
Standard
|
| Pages |
14
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
| Status |
Current
|
| Standards | Relationship |
| UNE-EN 60191-6-2:2003 | Identical |
| BS EN 60191-6-2:2002 | Identical |
| NF EN 60191-6-2 : 2002 | Identical |
| EN 60191-6-2:2002 | Identical |
| IEC 60191-6-2:2001 | Identical |
| I.S. EN 60191-6-2:2002 | Identical |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.