DIN EN 60191-6-6:2002-02
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES; DESIGN GUIDE FOR FINE PITCH LAND GRID ARRAY (FLGA)
Hardcopy , PDF
German
01-01-2002
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Foreword
Introduction
1 Scope
2 Normative references
3 Definitions
3.1 Flanged type
3.2 Type of real chip size
3.3 FLGA
3.4 Material designation
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Gives common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array whose terminal pitch is less than, or equal to, 0.80 mm and whose package body outline is square.
| DevelopmentNote |
Supersedes DIN IEC 47D-195-CD. (05/2002)
|
| DocumentType |
Standard
|
| Pages |
13
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
| Status |
Current
|
| Standards | Relationship |
| SN EN 60191-6-6 : 2001 | Identical |
| NF EN 60191-6-6 : 2002 | Identical |
| UNE-EN 60191-6-6:2002 | Identical |
| IEC 60191-6-6:2001 | Identical |
| I.S. EN 60191-6-6:2001 | Identical |
| EN 60191-6-6:2001 | Identical |
| BS EN 60191-6-6:2001 | Identical |
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