DIN EN 60191-6-6:2002-02
Current
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES; DESIGN GUIDE FOR FINE PITCH LAND GRID ARRAY (FLGA)
Available format(s)
Hardcopy , PDF
Language(s)
German
Published date
01-01-2002
Foreword
Introduction
1 Scope
2 Normative references
3 Definitions
3.1 Flanged type
3.2 Type of real chip size
3.3 FLGA
3.4 Material designation
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
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