DIN EN 60191-6-8:2002-05
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-8: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES; DESIGN GUIDE FOR GLASS SEALED CERAMIC QUAD FLATPACK (G-QFP)
Hardcopy , PDF
German
01-01-2002
Important note : Users cannot be edited or removed once added to your Multi user PDF.
Foreword
1 Scope and object
2 Normative references
3 Definitions
4 Numbering of the pins
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack. Also specifies outlines and obtain interchangeability of G-QFP.
| DevelopmentNote |
Supersedes DIN IEC 47D-131-CD. (05/2002)
|
| DocumentType |
Standard
|
| Pages |
14
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
| Status |
Current
|
| Standards | Relationship |
| BS EN 60191-6-8:2001 | Identical |
| UNE-EN 60191-6-8:2002 | Identical |
| IEC 60191-6-8:2001 | Identical |
| NF EN 60191-6-8 : 2002 | Identical |
| I.S. EN 60191-6-8:2002 | Identical |
| EN 60191-6-8:2001 | Identical |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.