DIN EN 60191-6-8:2002-05
Current
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-8: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES; DESIGN GUIDE FOR GLASS SEALED CERAMIC QUAD FLATPACK (G-QFP)
Available format(s)
Hardcopy , PDF
Language(s)
German
Published date
01-01-2002
€77.20
Excluding VAT
Foreword
1 Scope and object
2 Normative references
3 Definitions
4 Numbering of the pins
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack. Also specifies outlines and obtain interchangeability of G-QFP.
| DevelopmentNote |
Supersedes DIN IEC 47D-131-CD. (05/2002)
|
| DocumentType |
Standard
|
| Pages |
14
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
| Status |
Current
|
| Standards | Relationship |
| BS EN 60191-6-8:2001 | Identical |
| IEC 60191-6-8:2001 | Identical |
| NF EN 60191-6-8 : 2002 | Identical |
| I.S. EN 60191-6-8:2002 | Identical |
| EN 60191-6-8:2001 | Identical |
| UNE-EN 60191-6-8:2002 | Identical |
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