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DIN EN 60603-2:2006-04

Current

Current

The latest, up-to-date edition.

CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS - PART 2: DETAIL SPECIFICATION FOR TWO-PART CONNECTORS WITH ASSESSED QUALITY, FOR PRINTED BOARDS, FOR BASIC GRID OF 2.54 MM (0.1 IN) WITH COMMON MOUNTING FEATURES

Available format(s)

Hardcopy , PDF

Language(s)

German

Published date

01-01-2006

1 Anwendungsbereich
2 Normative Verweisungen
3 IEC-Normbezeichnung
4 Gemeinsame Merkmale
   4.1 Montagemasse
   4.2 Steckbedingungen
   4.3 Übersicht der Bauformen
5 Masse
   5.1 Allgemeines
   5.2 Feste Leiterplattensteckverbinder
   5.3 Freie Leiterplattensteckverbinder
   5.4 Steckbedingungen
   5.5 Zubehör
   5.6 Montagehinweise für feste Leiterplatten
       steckverbinder
   5.7 Montagehinweise für freie Leiterplatten
       steckverbinder
6 Lehren
   6.1 Aufweit- und Ziehkraftlehren
   6.2 Prüfplatte (Prüfung der Spannungsfestigkeit)
7 Kennwerte
   7.1 Klimatische Klassen
   7.2 Elektrische Kennwerte
   7.3 Mechanische Kennwerte
8 Prüfprogramm
   8.1 Allgemeines
9 Bauartanerkennungsverfahren
   9.1 Bauartanerkennungsprüfungen
   9.2 Qualitätskonformitätskontrollen
   9.3 Verzögerte Lieferung, Nachprüfung
10 Bestellangaben
Anhang A (normativ) Prüfablauf BP 3.2: Korrosion,
          Industrieatmosphäre
Anhang B (informativ) Sonderkontakte für
          Steckverbinder der Bauform M
Anhang ZA (normativ) Normative Verweisungen auf
          internationale Publikationen mit ihren
          entsprechenden europäischen Publikationen

Applicable to groups of related connectors to be used with printed boards. Include connectors with high contact density for low-voltage applications and range to connectors for heavy currents and high voltages with fewer contacts.

DevelopmentNote
Supersedes DIN 41612-1, -2, -3, -4, -5, -6, -7, -8, -9, -10, -102 DIN 41612-1 SUPP1, DIN 41612-8 SUPP1 and DIN IEC 48B-206. (10/1999)
DocumentType
Standard
Pages
93
PublisherName
German Institute for Standardisation (Deutsches Institut für Normung)
Status
Current
Supersedes

DIN EN 60097:1993-09 Grid systems for printed circuits (IEC 60097:1991); German version EN 60097:1993
DIN IEC 60760:1991-04 (Draft) FLAT, QUICK-CONNECT TERMINATIONS
DIN EN 60352-4:2001-09 Solderless connections - Part 4: Solderless non-accessible insulation displacement connections; General requirements, test methods and practical guidance (IEC 60352-4:1994 + A1:2000); German version EN 60352-4:1994 + A1:2000
DIN ISO 2859-1:2014-08 SAMPLING PROCEDURES FOR INSPECTION BY ATTRIBUTES - PART 1: SAMPLING SCHEMES INDEXED BY ACCEPTANCE QUALITY LIMIT (AQL) FOR LOT-BY-LOT INSPECTION (ISO 2859-1:1999 + COR. 1:2001 + AMD.1:2011)
DIN IEC 60326-3:1993-09 PRINTED BOARDS - PART 3: DESIGN AND USE OF PRINTED BOARDS
DIN IEC 60194:1992-11 PRINTED CIRCUITS; TERMS AND DEFINITION
DIN EN 60352-5:2012-10 Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance (IEC 60352-5:2012); German version EN 60352-5:2012
DIN EN 60068-1 : 2015 ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE (IEC 60068-1:2013)
DIN EN 60068-2-60 : 2016 ENVIRONMENTAL TESTING - PART 2-60: TESTS - TEST KE: FLOWING MIXED GAS CORROSION TEST (IEC 60068-2-60:2015)
DIN EN 60603-1:1998-07 CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS - PART 1: GENERIC SPECIFICATION: GENERAL REQUIREMENTS AND GUIDE FOR THE PREPARATION OF DETAIL SPECIFICATIONS, WITH ASSESSED QUALITY
DIN EN 60352-1:1998-04 SOLDERLESS CONNECTIONS - PART 1: WRAPPED CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE

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