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  • DIN EN 60603-2:2006-04

    Current The latest, up-to-date edition.

    CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS - PART 2: DETAIL SPECIFICATION FOR TWO-PART CONNECTORS WITH ASSESSED QUALITY, FOR PRINTED BOARDS, FOR BASIC GRID OF 2.54 MM (0.1 IN) WITH COMMON MOUNTING FEATURES

    Available format(s):  Hardcopy, PDF

    Language(s):  German

    Published date:  01-01-2006

    Publisher:  German Institute for Standardisation (Deutsches Institut für Normung)

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    Table of Contents - (Show below) - (Hide below)

    1 Anwendungsbereich
    2 Normative Verweisungen
    3 IEC-Normbezeichnung
    4 Gemeinsame Merkmale
       4.1 Montagemasse
       4.2 Steckbedingungen
       4.3 Übersicht der Bauformen
    5 Masse
       5.1 Allgemeines
       5.2 Feste Leiterplattensteckverbinder
       5.3 Freie Leiterplattensteckverbinder
       5.4 Steckbedingungen
       5.5 Zubehör
       5.6 Montagehinweise für feste Leiterplatten
           steckverbinder
       5.7 Montagehinweise für freie Leiterplatten
           steckverbinder
    6 Lehren
       6.1 Aufweit- und Ziehkraftlehren
       6.2 Prüfplatte (Prüfung der Spannungsfestigkeit)
    7 Kennwerte
       7.1 Klimatische Klassen
       7.2 Elektrische Kennwerte
       7.3 Mechanische Kennwerte
    8 Prüfprogramm
       8.1 Allgemeines
    9 Bauartanerkennungsverfahren
       9.1 Bauartanerkennungsprüfungen
       9.2 Qualitätskonformitätskontrollen
       9.3 Verzögerte Lieferung, Nachprüfung
    10 Bestellangaben
    Anhang A (normativ) Prüfablauf BP 3.2: Korrosion,
              Industrieatmosphäre
    Anhang B (informativ) Sonderkontakte für
              Steckverbinder der Bauform M
    Anhang ZA (normativ) Normative Verweisungen auf
              internationale Publikationen mit ihren
              entsprechenden europäischen Publikationen

    Abstract - (Show below) - (Hide below)

    Applicable to groups of related connectors to be used with printed boards. Include connectors with high contact density for low-voltage applications and range to connectors for heavy currents and high voltages with fewer contacts.

    General Product Information - (Show below) - (Hide below)

    Development Note Supersedes DIN 41612-1, -2, -3, -4, -5, -6, -7, -8, -9, -10, -102 DIN 41612-1 SUPP1, DIN 41612-8 SUPP1 and DIN IEC 48B-206. (10/1999)
    Document Type Standard
    Publisher German Institute for Standardisation (Deutsches Institut für Normung)
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    DIN EN 60097:1993-09 Grid systems for printed circuits (IEC 60097:1991); German version EN 60097:1993
    DIN IEC 60760:1991-04 (Draft) FLAT, QUICK-CONNECT TERMINATIONS
    DIN EN 60352-4:2001-09 Solderless connections - Part 4: Solderless non-accessible insulation displacement connections; General requirements, test methods and practical guidance (IEC 60352-4:1994 + A1:2000); German version EN 60352-4:1994 + A1:2000
    DIN ISO 2859-1:2014-08 SAMPLING PROCEDURES FOR INSPECTION BY ATTRIBUTES - PART 1: SAMPLING SCHEMES INDEXED BY ACCEPTANCE QUALITY LIMIT (AQL) FOR LOT-BY-LOT INSPECTION (ISO 2859-1:1999 + COR. 1:2001 + AMD.1:2011)
    DIN IEC 60326-3:1993-09 PRINTED BOARDS - PART 3: DESIGN AND USE OF PRINTED BOARDS
    DIN IEC 60194:1992-11 PRINTED CIRCUITS; TERMS AND DEFINITION
    DIN EN 60352-5:2012-10 Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance (IEC 60352-5:2012); German version EN 60352-5:2012
    DIN EN 60068-1 : 2015 ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE (IEC 60068-1:2013)
    DIN EN 60068-2-60 : 2016 ENVIRONMENTAL TESTING - PART 2-60: TESTS - TEST KE: FLOWING MIXED GAS CORROSION TEST (IEC 60068-2-60:2015)
    DIN EN 60603-1:1998-07 CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS - PART 1: GENERIC SPECIFICATION: GENERAL REQUIREMENTS AND GUIDE FOR THE PREPARATION OF DETAIL SPECIFICATIONS, WITH ASSESSED QUALITY
    DIN EN 60352-1:1998-04 SOLDERLESS CONNECTIONS - PART 1: WRAPPED CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE
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