DIN EN IEC 60749-20-1:2018-11 (Draft)
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labeling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 47/2488 / CDV: 2018); German and English version prEN IEC 60749-20-1: 2018
Hardcopy , PDF
German - English
02-11-2018
Important note : Users cannot be edited or removed once added to your Multi user PDF.This part of IEC 60749 applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices, and other moisture sensitive devices made with moisture-permeable materials (epoxies, silicones, etc.)that are exposed to the ambient air.
| Committee |
TC 47
|
| DocumentType |
Draft
|
| Pages |
0
|
| ProductNote |
this document also refers to ipc/jedec j-std-033.
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
| Status |
Current
|
| Supersedes |
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