Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2022); German version EN IEC 60749-37:2022

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German

Published date

01-12-2023

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DocumentType	Standard
Pages	0
PublisherName	German Institute for Standardisation (Deutsches Institut für Normung)
Status	Current
Supersedes	DIN EN IEC 60749-37:2023-02 (Draft) DIN EN 60749-37:2008-08

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DIN EN IEC 60749-37:2023-12