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DIN IEC 62047-9:2008-03 (Draft)

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 9: WAFER TO WAFER BONDING STRENGTH MEASUREMENT FOR MEMS

Superseded date

01-03-2012

Superseded by

DIN EN 62047-9:2012-03

Published date

12-01-2013

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In diesem Dokument sind Begriffe, Definitionen, Symbole und Messverfahren zur Festigkeit von Full-Wafer-Bondverbindungen innerhalb der Herstellung/Assemblierung von Bauelementen der Mikrosystemtechnik festgelegt.

DocumentType
Draft
PublisherName
German Institute for Standardisation (Deutsches Institut für Normung)
Status
Superseded
SupersededBy

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