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DIN IEC 62047-9:2008-03 (Draft)
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 9: WAFER TO WAFER BONDING STRENGTH MEASUREMENT FOR MEMS
01-03-2012
12-01-2013
In diesem Dokument sind Begriffe, Definitionen, Symbole und Messverfahren zur Festigkeit von Full-Wafer-Bondverbindungen innerhalb der Herstellung/Assemblierung von Bauelementen der Mikrosystemtechnik festgelegt.
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