DIN IEC/TS 62647-2 : 2013
Current
Current
The latest, up-to-date edition.
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 2: MITIGATION OF DELETERIOUS EFFECTS OF TIN (IEC/TS 62647-2:2012)
Published date
12-01-2013
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DevelopmentNote |
Also numbered as DIN SPEC 42647-2. (05/2012)
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DocumentType |
Standard
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PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
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Status |
Current
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Standards | Relationship |
IEC TS 62647-2:2012 | Identical |
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