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DIN IEC/TS 62647-2 : 2013

Current

Current

The latest, up-to-date edition.

PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 2: MITIGATION OF DELETERIOUS EFFECTS OF TIN (IEC/TS 62647-2:2012)

Published date

12-01-2013

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DevelopmentNote
Also numbered as DIN SPEC 42647-2. (05/2012)
DocumentType
Standard
PublisherName
German Institute for Standardisation (Deutsches Institut für Normung)
Status
Current

Standards Relationship
IEC TS 62647-2:2012 Identical

Sorry this product is not available in your region.