DOD STD 2000/3 : A NOTICE 1
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
CRITERIA FOR HIGH QUALITY/HIGH RELIABILITY SOLDERING TECHNOLOGY
Superseded date
17-10-1994
Superseded by
Published date
12-01-2013
Publisher
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| DocumentType |
Standard
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Superseded
|
| SupersededBy |
| DOD-STD-2000-1 Revision B:1986 | SOLDERING TECHNOLOGY, HIGH QUALITY/HIGH RELIABILITY |
| MIL C 83513 : C | CONNECTORS, ELECTRICAL, RECTANGULAR, MICROMINIATURE, POLARIZED SHELL, GENERAL SPECIFICATION FOR |
| MIL-C-28809 Revision B:1988 | CIRCUIT CARD ASSEMBLIES, RIGID, FLEXIBLE & RIGID FLEX |
| DOD-STD-2000-2 Revision A:1986 | PART AND COMPONENT MOUNTING FOR HIGH QUALITY/HIGH RELIABILITY SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| MIL-STD-1547 Revision B:1992 | ELECTRONIC PARTS, MATERIALS, AND PROCESSES FOR SPACE VEHICLES |
| MIL-S-83519 Revision A:1984 | SPLICE, SHIELD TERMINATION, SOLDER STYLE, INSULATION, HEAT SHRINKABLE, ENVIRONMENT RESISTANT, GENERAL SPECIFICATION FOR |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| MIL-STD-275 Revision E:1984 | PRINTED WIRING - ELECTRONIC EQUIPMENT |
| DOD-STD-2000-1 Revision B:1986 | SOLDERING TECHNOLOGY, HIGH QUALITY/HIGH RELIABILITY |
| MIL-M-38510 Revision J:1991 | MICROCIRCUITS, SPECIFICATION FOR |
| MIL-STD-1389 Revision D:1989 | DESIGN REQUIREMENTS FOR STANDARD ELECTRONIC MODULES |
| DOD-STD-2000-2 Revision A:1986 | PART AND COMPONENT MOUNTING FOR HIGH QUALITY/HIGH RELIABILITY SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
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