DS/EN IEC 62878-2-603:2025
Current
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Device embedding assembly technology – Part 2-603: Guideline for stacked electronic module – Test method of intra-module electrical connectivity
Published date
15-04-2025
Publisher
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IEC 62878-2-603:2025 specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules
| Committee |
DS/V-001
|
| DocumentType |
Test Method
|
| PublisherName |
Danish Standards
|
| Status |
Current
|
| Standards | Relationship |
| EN IEC 62878-2-603:2025 | Identical |
| IEC 62878-2-603:2025 | Identical |
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