DSCC 11006 : 0
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
PRINTED WIRING BOARD, FLEXIBLE RIGID FLEX, GENERAL DRAWING
Superseded date
16-07-2024
Publisher
1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. VERIFICATION
5. PACKAGING
6. NOTES
Specifies the requirements for a family of flexible and rigid-flex printed wiring boards that contain plated through holes.
| Committee |
FSC 5998
|
| DocumentType |
Standard
|
| PublisherName |
Defense Supply Centre Columbus
|
| Status |
Superseded
|
| SupersededBy |
| DSCC 11001 : 0 | PRINTED WIRING BOARD, FLEXIBLE, TYPE 1 (SINGLE-SIDED ) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER |
| DSCC 11004 : 0 | PRINTED WIRING BOARD, RIGID FLEX, TYPE 4 (MULTILAYERED) WITH SUPPORTED HOLES, WITH STIFFENER |
| DSCC 11005 : 0 | PRINTED WIRING BOARD, RIGID FLEX, TYPE 5 (MULTILAYER) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER |
| DSCC 11002 : 0 | PRINTED WIRING BOARD, FLEXIBLE, TYPE 2 (DOUBLE-SIDED) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER |
| DSCC 11003 : 0 | PRINTED WIRING BOARD, FLEXIBLE, TYPE 3 (MULTILAYER) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER |
| IPC J STD 609 : A | MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IPC 4552 : 0 | PERFORMANCE SPECIFICATION FOR ELECTROLESS NICKEL/IMMERSION GOLD (ENIG) PLATING FOR PRINTED BOARDS |
| SAE AMS 2422 : 2014 | PLATING, GOLD |
| IPC 4553 : A | SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS |
| MIL-PRF-81705 Revision E:2009 | Barrier Materials, Flexible, Electrostatic Discharge Protective, Heat-Sealable |
| IPC 2220 : LATEST | IPC 2220 FAMILY OF DESIGN DOCUMENTS |
| IPC 4202 : A | FLEXIBLE BASE DIELECTRICS FOR USE IN FLEXIBLE PRINTED BOARDS |
| MIL-STD-130 Revision N:2007 | IDENTIFICATION MARKING OF U.S. MILITARY PROPERTY |
| MIL-D-3464 Revision E:1987 | DESICCANTS, ACTIVATED, BAGGED, PACKAGING USE AND STATIC DEHUMIDIFICATION |
| IPC 9252 : A | REQUIREMENTS FOR ELECTRICAL TESTING OF UNPOPULATED PRINTED BOARDS |
| MIL-DTL-45204 Revision D:2007 | Gold Plating, Electrodeposited |
| SAE AMS QQ N 290 : 2015 | NICKEL PLATING (ELECTRODEPOSITED) |
| IPC D 325 : A | DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS |
| ASTM B 545 : 2013 : REDLINE | Standard Specification for Electrodeposited Coatings of Tin |
| IPC 4203 : A | COVER AND BONDING MATERIAL FOR FLEXIBLE PRINTED CIRCUITRY |
| IPC 4563 : 0 | RESIN COATED COPPER FOIL FOR PRINTED BOARDS GUIDELINE |
| SAE AMS 2418 : 2017 | PLATING, COPPER |
| IPC J STD 006 : C | REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| IPC SM 840 : E | QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| MIL-PRF-22191 Revision F:2008 | Barrier Materials, Transparent, Flexible, Heat-Sealable |
| SAE AMS 2403 : 2015 | PLATING, NICKEL, GENERAL PURPOSE |
| IPC 4204 : A | FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY |
| IPC OI 645 : 0 | STANDARD FOR VISUAL OPTICAL INSPECTION AIDS |
| SAE AMS P 81728 : 2015 | PLATING, TIN-LEAD (ELECTRODEPOSITED) |
| IPC 4781 : 0 | QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT, SEMI-PERMANENT AND TEMPORARY LEGEND AND/OR MARKING INK |
| IPC D 350 : 0 | PRINTED BOARD DESCRIPTION IN DIGITAL FORM |
| IPC 4562 : A | METAL FOIL FOR PRINTED BOARD APPLICATIONS |
| IPC J STD 003 : C | SOLDERABILITY TESTS FOR PRINTED BOARDS |
| IPC 2223 : C | SECTIONAL DESIGN STANDARD FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS |
| ASTM D 1867 : 2013 : REDLINE | Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring |
| MIL P 50884 : E | PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX, GENERAL SPECIFICATION FOR |
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